{"type":"rich","version":"1.0","provider_name":"Transistor","provider_url":"https://transistor.fm","author_name":"The Space Industry","title":"Packaging innovation for space applications - with Texas Instruments","html":"<iframe width=\"100%\" height=\"180\" frameborder=\"no\" scrolling=\"no\" seamless src=\"https://share.transistor.fm/e/28e9f46a\"></iframe>","width":"100%","height":180,"duration":2178,"description":"Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.\nIn the episode we cover:\nThe benefits of using plastic packages vs. ceramic packaging\nThese include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes\nThe role that Texas Instruments has played in supporting the standardization of QMLP\nHow and why TI will continue to offer QMLV-RHA (ceramic) packaging\nHow TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities\nYou can find out more about Texas Instruments here on their satsearch supplier hub.\nAnd if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter.\n[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/when-we-get-there License code: Y4KZEAESHXDHNYRA] ","thumbnail_url":"https://img.transistorcdn.com/Sh74tB8F1MYuWaWQNfGudJQYc3biKnhHcHOxbVUsuO8/rs:fill:0:0:1/w:400/h:400/q:60/mb:500000/aHR0cHM6Ly9pbWct/dXBsb2FkLXByb2R1/Y3Rpb24udHJhbnNp/c3Rvci5mbS9zaG93/LzE4NDc2LzE2MTI5/ODkyMTQtYXJ0d29y/ay5qcGc.webp","thumbnail_width":300,"thumbnail_height":300}