{"type":"rich","version":"1.0","provider_name":"Transistor","provider_url":"https://transistor.fm","author_name":"Additive Snack","title":"The AM Sasquatch: Challenging AM Qualification with Math, Physics, & AI","html":"<iframe width=\"100%\" height=\"180\" frameborder=\"no\" scrolling=\"no\" seamless src=\"https://share.transistor.fm/e/605e2f3f\"></iframe>","width":"100%","height":180,"duration":3328,"description":"Fabian Alefeld welcomes back Harshil Goel, founder and CEO of Dyndrite, to discuss how current additive manufacturing (AM) qualification practices limit advanced laser powder bed fusion toolpaths by locking variables such as software, machine, strategy, layer height, and material. Harshil reviews MQ, IQ, OQ, and PQ, noting cost and rigidity increase toward part qualification. \nThey discuss Dyndrite’s roles in multiple America Makes efforts: AI4AM to reduce the specimen counts needed for material allowables (starting with 17-4PH) using improved statistical methods; DeltaQual 2.0 to enable “bracketed qualification” so parameter changes within a defined process window don’t retrigger requalification (including varying layer heights within a part); and Gotham to transfer scalable, qualified parameter approaches across different machines and sizes using materials like Scalmalloy. \nHarshil describes “Sasquatch,” a physics-based KPV framework using ratios (e.g., energy density, enthalpy, melt pool dimensions) to bound process windows and increase confidence without relying solely on sensors or simulation, and highlights software and AI accelerating DOE and parameter iteration with a target program timeline of about two years.\n01:34 What Dyndrite Builds\n02:11 Why Qualification Blocks Innovation\n03:58 IQ OQ PQ MQ Explained\n08:22 PQ Locks Everything Down\n09:00 America Makes Program Overview\n09:57 AI4AM Materials Allowables\n12:39 Process Windows Not Fixed Params\n14:57 Delta Qual 2 Bracketed Qual\n17:38 Partners Sensors And Confidence\n19:25 Sasquatch New KPVs\n25:33 Gotham Scaling Across Machines\n27:07 Future Less PQ More Reuse\n28:39 Industry Impact Of Faster Qual\n29:52 Customer Owned Parameters\n30:54 Additive As Moat\n32:13 Microstructure Driven IP\n33:12 Selling Machine Control\n34:31 Breaking Vendor Silos\n35:36 Two Year Timeline\n37:57 Risks And Adoption\n41:23 Software As Glue\n42:11 AI Accelerated DOE\n45:34 Math Meets Empiricism\n49:48 Future Outlook Wrap","thumbnail_url":"https://img.transistorcdn.com/27ZYLdyZ8MHWZlxUWh87sIQyB5ttPhwcP3_CmUBDsv0/rs:fill:0:0:1/w:400/h:400/q:60/mb:500000/aHR0cHM6Ly9pbWct/dXBsb2FkLXByb2R1/Y3Rpb24udHJhbnNp/c3Rvci5mbS9zaG93/LzE2NDk0LzE3MDU5/NDgwMjItYXJ0d29y/ay5qcGc.webp","thumbnail_width":300,"thumbnail_height":300}