{"type":"rich","version":"1.0","provider_name":"Transistor","provider_url":"https://transistor.fm","author_name":"India Tech Report","title":"Agnikul raises fresh funding, smaller coolers for quantum chips, and more","html":"","width":"100%","height":180,"duration":265,"description":"Moin SPM and Srinath Ravichandran, Co-founders of Agnikul Cosmos, are pioneering India’s private small satellite launch vehicles with 3D printed engines.(00:20) Swiss quantum startup shrinks cooling systems for scalable processorsYQuantum has raised CHF 150,000 ($186,000) from Venture Kick to commercialize miniaturized cryogenic hardware for quantum computers. The startup’s compact components address a critical bottleneck: scaling superconducting qubits reliably. By replacing bulky cooling systems with high-performance alternatives, YQuantum brings quantum computing closer to practical deployment.The engineering team, drawn from UC Berkeley and ETH Zurich, targets a rapidly expanding quantum hardware market projected to reach billions in the coming years. Its first commercial units are expected by mid-2026.Listen to the episodeSpotifyYouTube(01:10) AI genomics platform launches to scale safer gene therapiesCassidy Bio has unveiled its AI-driven genomic foundation model with an $8 million seed round, backed by Ahren Innovation Capital. The platform combines proprietary lab data, population genetics, and machine learning to design gene-editing therapies at scale. By replacing trial-and-error with predictive engineering, Cassidy addresses persistent challenges: target selection, delivery, and off-target effects.The founding team unites CRISPR pioneers and AI leaders with the aim of moving genome editing from isolated successes to reliable, scalable medical solutions for millions of patients worldwide.(01:56) Swedish chipmaker secures €15 million for advanced etching techAlixLabs has closed a €15 million Series A investment led by Navigare Ventures to accelerate Atomic Layer Etching Pitch Splitting (APS) technology. The breakthrough enables cost-effective production of advanced chips without expensive multi-patterning or exclusive EUV reliance. By slashing process complexity and energy consumption per wafer, APS addresses a critical challenge in chip economics.Beta...","thumbnail_url":"https://img.transistorcdn.com/klwtZi6_OVxR1RQx-EUqBBLq9JNmkk2p0xt3ov7-eeg/rs:fill:0:0:1/w:400/h:400/q:60/mb:500000/aHR0cHM6Ly9pbWct/dXBsb2FkLXByb2R1/Y3Rpb24udHJhbnNp/c3Rvci5mbS9kYjRi/MTNkNDVhMTVlOThm/MDM4ZmVlYjFmZGNl/OGFiNy5wbmc.webp","thumbnail_width":300,"thumbnail_height":300}