{"type":"rich","version":"1.0","provider_name":"Transistor","provider_url":"https://transistor.fm","author_name":"The Circuit","title":"Episode 38: The Future of Transistor Design and Advanced Packaging","html":"<iframe width=\"100%\" height=\"180\" frameborder=\"no\" scrolling=\"no\" seamless src=\"https://share.transistor.fm/e/96e15039\"></iframe>","width":"100%","height":180,"duration":1989,"description":"Ben Bajarin is joined by guest Huiming Bu from IBM Research to discuss the future of the transistor (design) and advanced packaging. They also discuss some of the larger technology challenges facing the semiconductor industry  in the years to come. ","thumbnail_url":"https://img.transistorcdn.com/fYACcTX9lHJQV5HMEqnPC2MCPLH1nc-KdhtAT0N5lV4/rs:fill:0:0:1/w:400/h:400/q:60/mb:500000/aHR0cHM6Ly9pbWct/dXBsb2FkLXByb2R1/Y3Rpb24udHJhbnNp/c3Rvci5mbS9zaG93/LzM3MjEyLzE2NzQz/MTg3MzAtYXJ0d29y/ay5qcGc.webp","thumbnail_width":300,"thumbnail_height":300}