{"type":"rich","version":"1.0","provider_name":"Transistor","provider_url":"https://transistor.fm","author_name":"數位時代 6 in 5","title":"2024.6.24｜台積電傳研發「矩形基板」封裝！可用面積比傳統晶圓多3倍，挑戰是什麼？","html":"<iframe width=\"100%\" height=\"180\" frameborder=\"no\" scrolling=\"no\" seamless src=\"https://share.transistor.fm/e/ac373d03\"></iframe>","width":"100%","height":180,"duration":335,"description":"\n                本日重點關注新聞：\n                \n                台積電傳研發「矩形基板」封裝！可用面積比傳統晶圓多3倍，挑戰是什麼？\n蘋果AI為何只有iPhone 15 Pro能用？不是促銷也不是AI算力，真正原因是⋯⋯\n群創訂單滿手！FOPLP是什麼？有何封裝優勢？南科5.5代廠要賣美光？看懂群創轉型現況\n最強AI來了！Claude 3.5 Sonnet有多神？為何GPT-4o也輸它？一表看懂5大生成式AI性能差異\n王雪紅：HTC跟輝達有密切合作！宏達電運用輝達AI運算，加速Viverse生態系\nOpenAI宮鬥要角另起爐灶！新公司SSI有何使命？什麼是安全AI？3位創辦人有何來頭？\n\n                \n                ＊想閱讀更多訊息，免費訂閱電子報 https://bit.ly/3K5bq2o\n                ＊想看AI主播「魏時黛」，訂閱官方YouTube 頻道 https://lihi3.cc/mTmpw","thumbnail_url":"https://img.transistorcdn.com/-fcwFnNH-QRGMBk0oIyyIRr3mWqV1cdsd4uCezaBejQ/rs:fill:0:0:1/w:400/h:400/q:60/mb:500000/aHR0cHM6Ly9pbWct/dXBsb2FkLXByb2R1/Y3Rpb24udHJhbnNp/c3Rvci5mbS9mZmE1/NWNmNDkwZDY3ZjQ5/MzQ3MzFiNmNlODNi/OWZmOS5qcGc.webp","thumbnail_width":300,"thumbnail_height":300}