The Space Industry

Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.

In the episode we cover:
  • The benefits of using plastic packages vs. ceramic packaging
  • These include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classes
  • The role that Texas Instruments has played in supporting the standardization of QMLP
  • How and why TI will continue to offer QMLV-RHA (ceramic) packaging
  • How TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilities
You can find out more about Texas Instruments here on their satsearch supplier hub.

And if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter.


[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/when-we-get-there License code: Y4KZEAESHXDHNYRA] 

What is The Space Industry?

The Space Industry by satsearch - sharing stories about the businesses taking us into orbit.

We delve into the opinions and expertise of the people behind the commercial space companies of today, who could become the household names of tomorrow. Find out more about the companies and technologies discussed on this show at satsearch.com.