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Host Fabian Alefeld interviews Professor PS Lee, Head of National University of Singapore Mechanical Engineering & Program Director of STDCT, and founder of CoolestDC, about heat as a key constraint in AI infrastructure as data centers shift from CPU-heavy to GPU-dense systems with higher power density, hotspots, and bursty workloads. Lee explains why cooling must be treated as an integrated “chip to grid” system spanning cold plates, racks, CDUs, piping, controls, and operations, and discusses single-phase versus two-phase direct-to-chip liquid cooling and the added need for condensation in closed loops.
Professor Lee describes how additive manufacturing (AM) enables complex fin structures and unibody cold plates that reduce leakage risk, lower junction temperatures (~10°C), cut pumping power (60–70%+), and reduce material use, while requiring TCO evaluation. At NUS’s live testbed (22 liquid-cooled racks, ~500 kW), AM cold plates are being deployed and show promising thermal, power, and compute-performance improvements; future work includes two-phase cooling and broader system-level heat rejection, warm-water operation, and waste-heat reuse, plus a discussion of challenges and potential AM roles in space-based data centers.
20:40 AM Unibody Cold Plates
30:18 AM For CDUs
Creators and Guests
Host
Fabian Alefeld
What is Additive Snack?
Join host Fabian Alefeld and a range of guests as they discuss all things additive manufacturing (AM) and 3D printing news, with interviews and real-world stories to educate and entertain. Each episode, Fabian talks to AM experts, professionals in specialist fields, and 3D printing users from all walks of life to deliver a well-rounded view on the state of AM.
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